• PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
  • PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
  • PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production

PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production

Productdetails:

Plaats van herkomst: China
Merknaam: MK
Modelnummer: MKSP-S630T

Betalen & Verzenden Algemene voorwaarden:

Min. bestelaantal: 50 stuks
Prijs: negotiable
Verpakking Details: Krachtige multiplexverpakking met een passend zacht beschermingsmateriaal, geschikt voor langeafstan
Levertijd: 10-20 werkdagen
Betalingscondities: L/C, D/A, D/P, T/T, Western Union
Levering vermogen: 10000 vierkante meter per maand
Beste prijs Contact

Gedetailleerde informatie

Grondstof: Hoogwaardig binnenlands SUS630T roestvrij staal Standaard dikte: 1.0-2.0 mm
Maximale breedte: ≤ 1300 mm Maximale lengte: ≤2410mm
Productnaam: PCB & CCL SUS630T lamineringspersplaat Oppervlakteruwheid: Ra≤0,15μm, Rz≤1,5μm
Markeren:

SUS630T high-hardness lamination press plate

,

high-temperature resistant steel plate for PCB

,

corrosion resistant CCL production steel plate

Productomschrijving

PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate
MKSP-S630T high-precision lamination press plate utilizes premium domestic SUS630T stainless steel materials, delivering stable and reliable lamination performance with superior cost competitiveness. This specialized lamination steel plate for PCB and CCL production features exceptional thermal performance, high hardness, and outstanding corrosion resistance.
Product Advantages
SUS630T High-Hardness Lamination Press Plate | High Precision, High Temperature Resistance, Energy-Saving & Cost-Effective Solution for PCB & CCL Lamination
Feature Specification & Benefits
Raw Material High-quality domestic SUS630T stainless steel with mature, stable material formula
Cost Performance Reliable industrial-grade lamination quality with highly competitive pricing
Thermal Performance Excellent thermal conductivity and stable thermal expansion coefficient for significant energy and cost savings
Material Performance High hardness up to 50HRC±2, excellent corrosion resistance and mechanical stability
Equipment Compatibility Universally compatible with all types of industrial lamination steel plate washing machines
Application Scenarios Professional high-precision press plate for PCB printed circuit board and CCL copper clad laminate lamination processes
Standard Sizes
PCB Lamination Press Plate (L × W, mm):
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm):
1910×1270, 2210×1270, 2220×1270
Detailed Performance Parameters
Performance Parameter Mass-Lam Plate (SUS630T) Pin-Lam Plate (SUS630T)
Thickness 1.0-2.0mm 1.0-2.0mm
Max Width ≤1300mm ≤1300mm
Max Length ≤2410mm ≤2410mm
Thickness Tolerance ±0.10mm ±0.10mm
Surface Roughness Ra≤0.15μm, Rz≤1.5μm Ra≤0.15μm, Rz≤1.5μm
Positioning Hole Tolerance -- ±0.10mm
Standard Bushing Slot Tolerance -- 0 ~ +0.10mm
Warpage Degree ≤3mm/M ≤3mm/M
Length & Width Tolerance ±1mm ±1mm
Yield Strength ≥1175 N/mm² ≥1175 N/mm²
Tensile Strength ≥1400 N/mm² ≥1400 N/mm²
Extensibility ≥5% ≥5%
Hardness 50HRC±2 50HRC±2
Max Working Temperature ≤400℃ ≤400℃
Parallelism ≤0.03mm ≤0.03mm
Diagonal Deviation 1-2mm 1-2mm
Thermal Conductivity (@300℃) ≥18W/MK ≥18W/MK
Average Thermal Expansion Coefficient 10~12 (10⁻⁶/℃) 10~12 (10⁻⁶/℃)
PCB Lamination Steel Plate - High precision manufacturing process
SUS630T Lamination Press Plate for circuit board production

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